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    CP12 proberLocation:Home  >>  Product

    CP12 prober

     

    Item

    CP12 prober

    Dimension

    1620mm(W) *1230D*1450mm(H)

    Wafer

    200mm,300mm

    Wafer thickness

    250~2000μm

    Die Size

    350μm ~76,000μm

    Transfer mode

    Vacuum suction, dual arms

    Accuracy

    XY±1.5μm;Z±2.5μm

    XY platform

    Probing area ± 170mm, repeated positioning accuracy ± 1μm

    Z axis

    Repeated positioning accuracy ± 1.5μm, max speed 30mm/s

    Force

    50kg (optional 200kg)

    Calibration

    Image calibration, with high/low–power template

    Index time

    240ms (based on die size 6mm,Z clearance 0.5mm)

    Test temperature

    Ambient~150±1

    Communication interface

    GPIB, reserved TTL and RS232

    Option

    ID reading, auto card exchange

    Refer to the prober for CIS and SOC device.

     

    Copyright: Hangzhou ChangChuan Technology Co.,Ltd. Address: No. 410 Jucai Road, Binjiang District, Hangzhou

    Tel: +86-571-85096193 Fax: +86-571-88830180 Technical support: GXR Network

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